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Microstructures Variations of Sn–9Zn–1Al and Sn–8Zn–3Bi Solder Pastes with Sn–3.8Ag–0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test

  • Published:2013 Issue:3 Volume:54 Page:332-336
  • ISSN:1345-9678
  • Container-title:MATERIALS TRANSACTIONS
  • language:en
  • Short-container-title:Mater. Trans.

Author:

Wang Moo-Chin1,Lin Ching-Tsung2,Hsi Chi-Shiung2,Chang Tao-Chih3,Liang Ming-Kann3,Huang Hong-Hsin4

Affiliation:

1. Department of Fragrance and Cosmetic Science, Kaohsiung Medical University

2. Department of Materials Science and Engineering, National United University

3. Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute

4. Department of Electrical Engineering, Cheng Shiu University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Al-Sn-Zn Ternary Phase Diagram Evaluation;MSI Eureka;2021-12-30

2. Joining and Complex;Journal of the Japan Society for Technology of Plasticity;2014
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