Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
Author:
Affiliation:
1. Department of Materials Science and Engineering, Korea University
2. Department of Mechanical Engineering, Chung-Ang University
3. Department of Energy & Resources Engineering, College of Engineering, Peking University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/50/11/50_M2009242/_pdf
Reference7 articles.
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2. 2) N. Eustathopoulos, M. G. Nicholas and B. Drevet: Wettability at High Temperatures, (Pergamon, Amsterdam, 1999) p. 43.
3. 3) M. Li, F. Zhang, W. T. Chen, K. Zeng, K. N. Tu, H. Balkan and P. Elenius: J. Mater. Res. 17 (2002) 1612–1621.
4. 4) J. Liang, N. Dariavach, P. Callahan and D. Shangguan: Mater. Trans. 47 (2006) 317–325.
5. 5) W. K. Choi and H. M. Lee: J. Electron. Mater. 28 (1999) 1251–1255.
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