Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding-Reference-Cited by-同舟云学术

Change in Microstructure and Texture during Annealing of Pure Copper Heavily Deformed by Accumulative Roll Bonding

Published:2007 Issue:8 Volume:48 Page:2043-2048
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Takata Naoki¹,Yamada Kousuke²,Ikeda Ken-ichi³,Yoshida Fuyuki³,Nakashima Hideharu³,Tsuji Nobuhiro¹

Affiliation:

1. Dept. of Adaptive Machine Systems, Graduate School of Engineering, Osaka University

2. Dept. Molecular and Material Sciences, Interdisciplinary Graduate School of Engineering Science, Kyushu University

3. Faculty of Engineering Sciences, Kyushu University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/48/8/48_MA200701/_pdf

Reference22 articles.

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2. 2) N. Tsuji, Y. Saito, S. H. Lee and Y. Minamino: Adv. Eng. Mater. 5 (2003) 338–342.

3. 3) Y. Saito, H. Utsunomiya, N. Tsuji and T. Sakai: Acta Mater. 47 (1999) 579–583.

4. 4) Y. Saito, N. Tsuji, H. Utsunomiya, T. Sakai and H. G. Hong: Srcipta. Mater. 39 (1998) 1221–1227.

5. 5) O. V. Mishin and G. Gottstein: Phil. Mag. A 78 (1998) 373–388.

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