Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders-Reference-Cited by-同舟云学术

Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders

Published:2005 Issue:11 Volume:46 Page:2344-2350
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Lee Joo Won¹,Lee Zin Hyoung¹,Lee Hyuck Mo¹

Affiliation:

1. Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/46/11/46_11_2344/_pdf

Reference34 articles.

1. 1) A. W. Gibson, S. L. Choi, K. N. Subramanian and T. R. Bieler: Proceedings of Design and Reliability of Solders and Solder Interconnects, ed. by R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw and W. L. Winterbottom (TMS, Warrendale, PA, USA, 1997) pp. 97–103.

2. 2) S. L. Choi, A. W. Gibson, J. L. McDougall, T. R. Bieler and K. N. Subramanian: Proceedings of Design and Reliability of Solders and Solder Interconnects, ed. by R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw and W. L. Winterbottom, (TMS, Warrendale, PA, USA 1997) pp. 241–245.

3. 3) K. N. Subramanian, T. R. Bieler and J. P. Lucas: J. Electron. Mater. 28 (1999) 1176–1183.

4. 4) J. Sigelko, S. Choi, K. N. Subramanian, J. P. Lucas and T. R. Bieler: J. Electron. Mater. 28 (1999) 1184–1188.

5. 5) S. Choi, T. R. Bieler, J. P. Lucas and K. N. Subramanian: J. Electron. Mater. 28 (1999) 1209–1215.

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