Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements-Reference-Cited by-同舟云学术

Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements

Published:1999-11 Issue:11 Volume:28 Page:1184-1188
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Sigelko Jeff,Choi S.,Subramanian K. N.,Lucas James P.,Bieler T. R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-999-0155-2.pdf

Reference9 articles.

1. C.M. Miller, I.E. Anderson, and S. F. Smith, J. Electron. Mater. 23, 595 (1994).

2. M. McCormack, S. Jin, and G.W. Kammlott, IEEE Trans. Components, Packaging and Manufacturing Technology, Part A 17, 452 (1994).

3. C.G. Kue, S.M.L. Sastry, and K.L. Jerina, Proc. First Int. Conf. Microstructures and Mechanical Properties of Aging Materials, ed. P.K. Liaw et al. (Warrendale, PA: TMS, 1993), p. 409.

4. R.B. Clough, R. Patel, J.S. Hwang, and G. Lucey, Proc. Technical Program III, National Electronic Packaging and Production Conference (Des Plaines, IL: Cahner-Exposition Group, 1992), p. 1256.

5. M.A. Wasynczuk and G.K. Lucey, Proc. Technical Program III, National Electronic Packaging and Production Conference (Des Plaines, IL: Cahner-Exposition Group, 1992), p. 1245.

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