Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating-Reference-Cited by-同舟云学术

Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating

Published:2005 Issue:12 Volume:46 Page:2730-2736
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Nakamura Kiyotomo¹,Shohji Ikuo²,Goto Hiroki²,Ookubo Toshikazu¹

Affiliation:

1. Technical Research Institute, Toppan Printing Co., Ltd.

2. Department of Mechanical System Engineering, Gunma University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/46/12/46_12_2730/_pdf

Reference13 articles.

1. 1) K. Nimmo: Proc. JISSO/PROTEC Forum Japan 2001 (Japan Electronics and Information Technology Industries Association, 2001) pp. 111–118.

2. 2) H. Kasuga: Proc. SMT/PROTEC Forum ’99 (Electronic Industries Association of Japan, 1999) pp. 75–81.

3. 3) Y. Kariya, K. Nakamura, Y. Tanaka and M. Otsuka: Proc. 6th Symposium on Microjoining and Assembly Technology in Electronics (The Japan Welding Society, 2000) pp. 217–222.

4. 4) H. Otani, K. Honma, Y. Okinaka, T. Osaka, T. Okubo, K. Nakamura and T. Tsukamoto: Collected Abstracts of 17th Annual Meeting of Japan Inst. of Electronics Package (2003) pp. 187–188.

5. 5) K. Shimoyama, Y. Takase, Z. Mitsukoshi and M. Nishiura: Proc. 7th Symposium on Microjoining and Assembly Technology in Electronics (The Japan Welding Society, 2001) pp. 237–240.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper;Procedia Engineering;2017

2. Effect of Shear Speed on the Ball Shear Strength of Sn-3Ag-0.5Cu Solder Ball Joints;Transactions of The Japan Institute of Electronics Packaging;2008