Author:
Maruya Yuki,Hata Hanae,Shohji Ikuo,Koyama Shinji
Reference15 articles.
1. R. J. K. Wassink, Soldering in electronics, Electrochemical Publications Ltd., Scotland, 1984.
2. Investigation of multi-component lead-free solders;Loomans;J. Electron. Mater.,1994
3. Evaluation of lead-free solder joints in electronic assemblies;Artaki;J. Electron. Mater.,1994
4. J. Bath, Lead-free soldering, Springer, New York, 2007.
5. Comparison of immersion gold plating in reliability of a lead-free solder joint with autocatalytic electroless gold plating;Nakamura;Materials Transactions,2005
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