Microstructural Characteristics and the Charge-Discharge Characteristics of Sn-Cu Thin Film Materials-Reference-Cited by-同舟云学术

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Microstructural Characteristics and the Charge-Discharge Characteristics of Sn-Cu Thin Film Materials

Published:2009 Issue:2 Volume:50 Page:381-387
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Wu Chao-Han¹,Hung Fei-Yi²,Lui Truan-Sheng¹,Chen Li-Hui¹

Affiliation:

1. Department of Materials Science and Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University

2. Institute of Nanotechnology and Microsystems Engineering, Center for Micro/Nano Science and Technology, National Cheng Kung University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/50/2/50_MER2008291/_pdf

Reference29 articles.

1. 1) W. Pu, X. He, J. Ren, C. Wan and C. Jiang: Electrochim. Acta 50 (2005) 4140–4145.

2. 2) N. Tamura, R. Ohshita, M. Fujimoto, S. Fujitani, M. Kamino and I. Yonezu: J. Power Sources 107 (2002) 48–55.

3. 3) K. D. Kepler, J. T. Vaughey and M. M. Thackeray: J. Power Sources 81–82 (1999) 383–387.

4. 4) G. X. Wang, L. Sun, D. H. Bradhurst, S. X. Dou and H. K. Liu: J. Alloy. Compd. 299 (2000) 12–15.

5. 5) J. Chouvin, J. Olivier-Fourcade, J. C. Jumas, B. Simon and O. Godiveau: Chem. Phys. Lett. 308 (1999) 413–420.

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