Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Graduate School of Engineering, Osaka University
3. Mitsui Mining & Smelting Co., Ltd.
4. Hikoshima Smelting Co., Ltd.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/51/10/51_MJ201020/_pdf
Reference14 articles.
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2. 2) D. Lu and C. P. Wong: Int. J. Adhesion Adhesive 20 (2000) 189–193.
3. 3) H. K. Kim and F. G. Shi: Microelectron. J. 32 (2001) 315–321.
4. 4) M. Yamashita and K. Suganuma: J. Electron. Mater. 31 (2002) 551–556.
5. 5) K. S. Moon, S. Liong, H. Li and C. P. Wong: J. Electron. Mater. 33 (2004) 1381–1388.
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