Development of Lotus-Type Porous Copper Heat Sink-Reference-Cited by-同舟云学术

Development of Lotus-Type Porous Copper Heat Sink

Published:2006 Issue:9 Volume:47 Page:2240-2247
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Ogushi Tetsuro¹,Chiba Hiroshi¹,Nakajima Hideo²

Affiliation:

1. Mechanical Technology Department, Advanced Technology R&D Center, Mitsubishi Electric Corporation

2. The Institute of Scientific and Industrial Research, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/47/9/47_9_2240/_pdf

Reference18 articles.

1. 1) S. Nishio: Proc. 2nd Symposium on Thermal Design and Thermal Management Technology (Japan Management Association) A5-1 (2002) 1–11 (in Japanese).

2. 2) D. B. Tuckerman and R. F. W. Pease: IEEE Electron Device Letters 5 (1981) 126–129.

3. 3) Q. Weilin, G. M. Mala and L. Dongqing: Int. J. Heat Mass Transfer 43 (2000) 353–364.

4. 4) S. J. Kim: Proc. Int. Symp. Micro-Mechanical Engineering (2003) 1–10.

5. 5) S. P. Jang, S. J. Kim and K. W. Paik: Sensors and Actuators A 105 (2003) 211–224.

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