Author:
Jang Seok Pil,Kim Sung Jin,Paik Kyung Wook
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Heat transfer enhancement using flow-induced vibration of a microfin array;Go;Sens. Actuators A,2001
2. High-performance heat sinking for VLSI;Tuckerman;IEEE Electr. Device Lett.,1981
3. D.B. Tuckerman, R.F.W. Pease, Ultrahigh thermal conductance microstructures for integrated circuits, in: IEEE Proceedings of the 32nd Electronics Conference, 1982, pp. 145–149.
4. Thermal management in semiconductor device packaging;Mahaligam;IEEE Proc.,1985
5. Forced convection in microstructures for electronic equipment cooling;Kim;ASME J. Heat Transf.,1999
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