Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder
Author:
Affiliation:
1. Materials Engineering, The University of Queensland
2. Nihon Superior Co., Ltd, NS Bldg.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/49/3/49_MBW200713/_pdf
Reference17 articles.
1. 1) T. Nishimura: Lead-free solder, International Patent No. EP1043112, (2000).
2. 2) T. Nishimura: Lead-free solder alloy, US Patent No. US6180055, (2001).
3. 3) T. Nishimura: Materia Japan 43 (2004) 651–654.
4. 4) C. M. Gourlay, J. Read, K. Nogita and A. K. Dahle: Journal of Electronic Materials 37 (2008) 51–56.
5. 5) T. Ventura, C. M. Gourlay, K. Nogita, T. Nishimura, M. Rappaz and A. K. Dahle: Journal of Electronic Materials 37 (2008) 32–39.
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