Deformation Behavior of Thick Aluminum Wire during Ultrasonic Bonding
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Graduate School of Engineering, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/54/6/54_MD201210/_pdf
Reference17 articles.
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3. 3) J. E. Krzanowski and N. Murdeshwar: J. Electron. Mater. 19 (1990) 919–928.
4. 4) I. Lum, J. P. Jung and Y. Zhou: Metall. Mater. Trans. A 36 (2005) 1279–1286.
5. 5) I. Lum, M. Mayer and Y. Zhou: J. Electron. Mater. 35 (2006) 433–442.
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