Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper-Reference-Cited by-同舟云学术

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Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

Published:2016 Issue:9 Volume:57 Page:1411-1417
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Miyajima Yoji¹,Uchiyama Midori¹,Adachi Hiroki²,Fujii Toshiyuki³,Onaka Susumu¹,Kato Masaharu¹

Affiliation:

1. Department of Materials Science and Engineering, Tokyo Institute of Technology

2. Department of Materials and Synchrotron Radiation Engineering, Graduate School of Engineering, University of Hyogo

3. Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/57/9/57_MH201506/_pdf

Reference17 articles.

1. 1) A. Azushima, R. Kopp, A. Korhonen, D.Y. Yang, F. Micari, G.D. Lahoti, P. Groche, J. Yanagimoto, N. Tsuji, A. Rosochowski and A. Yanagida: CIRP Annu.-Manuf. Technol. 57 (2008) 716–735. 10.1016/j.cirp.2008.09.005

2. 2) S. Onaka: J. Japan Inst. Metals 74 (2010) 165–170. 10.2320/jinstmet.74.165

3. 3) N. Kamikawa, N. Tsuji and Y. Minamino: Sci. Technol. Adv. Mater. 5 (2004) 163–172. 10.1016/j.stam.2003.10.018

4. 4) N. Kamikawa, N. Tsuji, X.X. Huang and N. Hansen: Mater. Trans. 48 (2007) 1978–1985. 10.2320/matertrans.MA200702

5. 5) N. Kamikawa, T. Sakai and N. Tsuji: Acta Mater. 55 (2007) 5873–5888. 10.1016/j.actamat.2007.07.002

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1. High strength and low electrical resistivity of Al-0.1 at%Ni alloys produced by accumulative roll bonding;Materials Today Communications;2022-12

2. Effect of Annealing on the Microstructure, Hardness, Electrical Conductivity, and Corrosion of Copper Material before Accumulative Roll Bonding Processes;Journal of Engineering;2022-09-29

3. Plastic instability criterion based on new necking parameters for Cu–Al, Cu–A5052, and Cu–A5083 roll-bonded laminated metal composites fabricated without post-annealing;Journal of Materials Processing Technology;2022-08

4. A Comparison Study of Electrical Resistivity, Vickers Hardness, and Microstructures of Alloy 625 Prior and Posterior to Rolling;MATERIALS TRANSACTIONS;2022-03-01

5. A Comparison Study of Electrical Resistivity, Vickers Hardness, and Microstructures of Alloy 625 Prior and Posterior to Rolling;Journal of the Japan Institute of Metals and Materials;2021-10-01

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