Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper

Author:

Miyajima Yoji1,Uchiyama Midori1,Adachi Hiroki2,Fujii Toshiyuki3,Onaka Susumu1,Kato Masaharu1

Affiliation:

1. Department of Materials Science and Engineering, Tokyo Institute of Technology

2. Department of Materials and Synchrotron Radiation Engineering, Graduate School of Engineering, University of Hyogo

3. Department of Metallurgy and Ceramics Science, Tokyo Institute of Technology

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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