Investigation of Bonding Mechanism for Cu-Powder Contained Solderable Epoxy-Solder Composites
Author:
Affiliation:
1. School of Mechanical Engineering, Chung-Ang University
2. School of Mechanical System Engineering, Kangwon National University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/62/12/62_MT-M2021144/_pdf
Reference12 articles.
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2. 2) B.S. Yim, J.I. Lee, Y. Heo, J. Kim, S.H. Lee, Y.E. Shin and J.M. Kim: Mater. Trans. 53 (2012) 2104–2110. doi:10.2320/matertrans.MB201207
3. 3) B.S. Yim, Y. Kwon, S.H. Oh, J. Kim, Y.E. Shin, S.H. Lee and J.M. Kim: Microelectron. Reliab. 52 (2012) 1165–1173. doi:10.1016/j.microrel.2011.12.004
4. 4) B.S. Yim, J.I. Lee, B.H. Lee, Y.E. Shin and J.M. Kim: Microelectron. Reliab. 54 (2014) 2944–2950. doi:10.1016/j.microrel.2014.07.143
5. 5) F. Hua, Z. Mei and J. Glazer: Proc. 48th IEEE Electronic Components and Technology Conference 47 (1998) pp. 277–283.
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