Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
Author:
Affiliation:
1. School of Mechanical Engineering, Chung-Ang University
2. School of Chemical Engineering & Material Science, Chung-Ang University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/53/12/53_MB201207/_pdf
Reference23 articles.
1. 1) F. Tan and X. Qiao: Int. J. Adhes. Adhes. 26 (2006) 406–413.
2. 2) M. J. Yim, Y. Li, K. S. Moon, K. W. Paik and C. P. Wong: J. Adhes. Sci. Technol. 22 (2008) 1593–1630.
3. 3) A. Seppealea and E. Ristolainen: Microelectron. Reliab. 44 (2004) 639–648.
4. 4) M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Harmansen, S. Lau and D. Napp: IEEE Trans. Compon. Packag. Manuf. Tech. C 19 (1996) 241–250.
5. 5) K. S. Moon, J. Wu and C. P. Wong: IEEE Trans. Compon. Packag. Tech. 26 (2003) 375–381.
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