Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material-Reference-Cited by-同舟云学术

Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material

Published:2002 Issue:8 Volume:43 Page:1868-1872
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Knott Sabine¹,Mikula Adolf¹

Affiliation:

1. Institut für Anorganische Chemie, Universität Wien, Währingerstr.

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/43/8/43_8_1868/_pdf

Reference48 articles.

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2. 2) B. P. Richards, C. L. Levoguer, C. P. Hunt, K. Nimmo, S. Peters and P. Cusack: Lead-free Soldering, (Department of Trade and Industry, London, UK, 1999) pp. 1–80.

3. 3) B. Richards and K. Nimmo: Lead-free Soldering-Update, (Department of Trade and Industry, London, UK, 2000) pp. 1–11.

4. 4) I. Ohnuma, X. J. Liu, H. Ohtani and K. Ishida: J. Electronic Materials 28 (1999) 1164–1171.

5. 5) S. Karlhuber, K. L. Komarek and A. Mikula: Z. Metallkd. 85 (1994) 307–311.

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