Thermodynamic activity in Zn–Cu–Sn–In liquid solder alloys: a comprehensive analysis using the molecular interaction volume model-Reference-Cited by-同舟云学术

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Thermodynamic activity in Zn–Cu–Sn–In liquid solder alloys: a comprehensive analysis using the molecular interaction volume model

Published:2024-03-18 Issue:4 Volume:38 Page:265-276
ISSN:0950-7116
Container-title:Welding International
language:en
Short-container-title:Welding International

Author:

Sah Sanjay Kumar¹²,Jha Indu Shekhar³,Koirala Ishwar¹

Affiliation:

1. Central Department of Physics, Tribhuvan University, Kirtipur, Kathmandu, Nepal

2. Department of Physics, Birendra Multiple Campus, Tribhuvan University, Bharatpur, Nepal

3. Department of Physics, M.M.A.M. Campus, Tribhuvan University, Biratnagar, Nepal

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/09507116.2024.2325151

Reference29 articles.

1. Application of molecular interaction volume model in vacuum distillation of Pb-based alloys

2. Prediction of the coordination numbers of liquid metals

3. Prediction of activities of all components in Sn-Ag-Cu and Sn-Ag-Cu-Zn lead-free solders using modified molecular interaction volume model

4. Lead-free Solders in Microelectronics

5. Thermodynamic optimization of the lead-free solder system Bi–In–Sn–Zn

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