Friction Bonding of Silicon Carbide to Oxygen-Free Copper with an Intermediate Layer of Reactive Metal
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Akita National College of Technology
3. Hyogo Prefectural Institute of Industrial Research
Publisher
Japan Institute of Metals
Subject
General Engineering
Link
https://www.jstage.jst.go.jp/article/matertrans1989/41/12/41_12_1636/_pdf
Reference30 articles.
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3. 3) S. Morozumi, M. Endo, M. Kikuchi and K. Hamajima: J. Mater. Sci., 20 (1985), 3976–3982.
4. 4) K. Suganuma, T. Okamoto, Y. Miyamoto, M. Shimada and M. Koizumi: Mater. Sci. Technol., 2 (1986), 1156–1161.
5. 5) Y. Nakao, K. Nishimoto K. Saida and H. Katada: Quarterly Journal of JWS, 5 (1987), 54–59.
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