Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging-Reference-Cited by-同舟云学术

Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging

Published:2016 Issue:6 Volume:57 Page:833-837
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Luo Hu¹,Gan Gui-sheng¹²,Du Yunfei³,Yang Donghua¹,Wang Huaishan¹,Meng Guoqi¹

Affiliation:

1. Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology (Chongqing University of technology)

2. College of Materials Science and Engineering, Huazhong University of Science and Technology

3. School of language studies,Chongqing University of Technology

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/57/6/57_MD201508/_pdf

Reference21 articles.

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3. 3) E.E.M. Noor and A. Singh: Soldering & Surface Mount Technology 26 (2014) 147–161. 10.1108/SSMT-02-2014-0001

4. 4) Y.P. Zhang, Z.H. Wan, L. Xu, F.M. Liu, K.Z. Yang: Journal of Materials Engineering (2010) 100–104. (In Chinese)

5. 5) F.X. Che, W.H. Zhu, S.W. Edith, X.W. Poh and X.R. Zhang: J. Alloy. Compd. 507 (2010) 215–224. 10.1016/j.jallcom.2010.07.160

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