Tensile Properties and Thermal Shock Reliability of Sn–Ag–Cu Solder Joint with Indium Addition-Reference-Cited by-同舟云学术

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Tensile Properties and Thermal Shock Reliability of Sn–Ag–Cu Solder Joint with Indium Addition

Published:2012-04-01 Issue:4 Volume:12 Page:3655-3657
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j. nanosci. nanotech.

Author:

Yu A-Mi,Jang Jae-Won,Lee Jong-Hyun,Kim Jun-Ki,Kim Mok-Soon

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

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4. Effects of NiP Nodule Interfacial Morphology on Solder-Ball-Joint Reliability;Nanoscience and Nanotechnology Letters;2017-08-01

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