Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating-Reference-Cited by-同舟云学术

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Filling a Narrow and High Aspect-Ratio Trench with Electro-Cu Plating

Published:2006 Issue:5 Volume:47 Page:1417-1419
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Chonan Yasunori¹,Komiyama Takao¹,Onuki Jin²,Nagano Takahiro³,Akahoshi Haruo⁴,Itabashi Takeyuki⁵,Saito Tatuyuki⁶,Khoo Khyoupin²

Affiliation:

1. Department of Electronics and Information Systems, Factory of System Science and Technology, Akita Prefectual University

2. Department of Materials Science and Engineering Ibaraki University

3. Intellexres Laboratory

4. Hitachi Research Laboratory

5. Advanced Research Laboratory, Hitachi Ltd.

6. Hitachi, Ltd.

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/47/5/47_5_1417/_pdf

Reference5 articles.

1. 1) N. Owada: Materia Japan 43 (2004) 7–11.

2. 2) T. Haba, T. Itabashi, H. Akahoshi, A. Sano, K. Kobayashi and H. Miyazaki: Mater. Trans. 43 (2002) 1593–1598.

3. 3) J. REID: Appl. Phys. 40 (2001) 2650–2657.

4. 4) O. Nakagawa et al.: Latest evolution of Cu-Interconnect Technology (Realize Advanced Technology Limited, Tokyo, 1998) pp. 29–39.

5. 5) M. Moriyama, S. Konishi, S. Tsukimoto and M. Murakami: Mater. Trans. 45 (2004) 3172–3176.

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