Basic Study for Direct Metallization Using Surface Modification of Polyimide and Epoxy Resin.-Reference-Cited by-同舟云学术

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Basic Study for Direct Metallization Using Surface Modification of Polyimide and Epoxy Resin.

Published:1999 Issue:5 Volume:2 Page:390-393
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

NAWAFUNE Hidemi,NISHIOKA Taro,TSUJI Haruo,MIZUMOTO Shozo,SEITA Masaru,KUSAKA Masaru

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep1998/2/5/2_5_390/_pdf

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Differences in the Modification Effect in the Depth Direction on the Surface of Epoxy Resin Irradiated with Vacuum Ultraviolet Light;Journal of Electronic Materials;2024-06-27

2. Practical Application of Electroless Plating Technology to Polyimide;Journal of The Surface Finishing Society of Japan;2024-02-01

3. Metallization of Polyimide Film Using Electroless Ni Plating Technique and its Mass Production;Journal of The Surface Finishing Society of Japan;2019-04-01

4. Recent Topics in the Material Technology for Printed Wiring Board;Journal of The Japan Institute of Electronics Packaging;2013

5. Two-Step Reduction Process for Direct-Metallization;Transactions of The Japan Institute of Electronics Packaging;2010

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