Differences in the Modification Effect in the Depth Direction on the Surface of Epoxy Resin Irradiated with Vacuum Ultraviolet Light-Reference-Cited by-同舟云学术

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Differences in the Modification Effect in the Depth Direction on the Surface of Epoxy Resin Irradiated with Vacuum Ultraviolet Light

Published:2024-06-27 Issue:9 Volume:53 Page:5449-5459
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Endo Shinichi^ORCID,Ishikawa Yuki,Shirakashi Hina,Saito Takeyasu

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s11664-024-11221-7.pdf

Reference32 articles.

1. Y. Taur, CMOS design near the limit of scaling. IBM Journal Res & Dev. 46, 213 (2002).

2. IEEE Electronics Packaging Society, International Technology Roadmap for Semiconductors 2.0. 2015 Edition Heterogeneous Integration (2015).

3. IEEE IRDSTM, International Roadmap for Devices and Systems. 2022 Executive Summary (2022).

4. H. Narahashi, S. Nakamura, and T. Yokota, Novel thin copper transfer films for fine line formation on PCB substrates. Trans. Jpn. Inst. Electron. Packag. 3–1, 86 (2010).

5. G. Mago, Interlayer insulating material for build-up substrates. The Latest Technology of Epoxy Resin for Electric Devices II, CMC Publishing Co. Ltd., 212 (2011).

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