The Effects of Diallylamine Compounds on Copper Via Fill Plating
Author:
Affiliation:
1. Department of chemical engineering, Graduate School of Engineering, Osaka Prefecture University
2. Nittobo medical Co., Ltd.
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/18/4/18_245/_pdf
Reference10 articles.
1. 1) S. Miura and H. Honma: “Advanced copper electroplating for application of electronics,” Surface and Coatings Technology, Vol. 169-170, pp. 91-95, 2003
2. 4) K. Kondo, N. Yamakawa, Z. Tanaka, and K. Hayashi: “Copper damascene electrodeposition and additives,” Journal of Electroanalytical Chemistry, Vol. 559, pp. 137-142, 2003
3. 5) Y. Jin, K. Kondo, Y. Suzuki, T. Matsumoto, and D. P. Barkey: “Surface Adsorption of PEG and ClÀ Additives for Copper Damascene Electrodeposition,” Electrochemical and Solid-State Letters, Vol. 8, No. 1, pp. C6-C8, 2005
4. 6) C. Wang, J. Zhang, P. Yang, and M. An: “Through-Hole Filling by Copper Electroplating Using Sodium Thiazolinyl-Dithiopropane Sulfonate as the Single Additive,” Int. J. Electrochem. Sci., Vol. 7, pp. 10644-10651, 2012
5. 7) W. P. Dow, H. H. Chen, M. Y. Yen, W. H. Chen, K. H. Hsu, P. Y. Chuang, H. Ishizuka, N. Sakagawa, and R. Kimizukad: “Through-Hole Filling by Copper Electroplating,” J. Electrochem. Soc., Vol. 155, pp. D750-D757, 2008
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