Interposer Technology Development Which is the Most Appropriate for 2.5D Packaging
Author:
Affiliation:
1. WEISTI (Worldwide Electronic Integrated Substrate Technology Inc.)
2. Next Generation MEMS Laboratory, Research & Development Center, DNP (Dai Nippon Printing Co., Ltd.)
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/18/3/18_150/_pdf
Reference3 articles.
1. 1) J. H. Lau: “Evolution, Challenge, and Outlook of TSV and 3D IC/Si Integration,” Proceedings of ICEP 2011 Keynote Speech, Nara, April 2011
2. 2) T. Mori, M. Yamaguchi, S. Kuramochi, and Y. Fukuoka: “Development of a New Interposer Including Embedded Thin Film Passive Elements,” IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 503-508, May 2009
3. 3) S. Kuramochi, S. Koiwa, K. Suzuki, and Y. Fukuoka: “Cost Effective Interposer for Advanced Electronic Packages,” Proceedings of ECTC 2014, Orland, pp. 1673-1678, May 2014
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