Cost effective interposer for advanced electronic packages
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897521.pdf?arnumber=6897521
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Development of Glass core substrate with the stress analysis, transmission characteristics and reliability;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology;Journal of Micromechanics and Microengineering;2022-04-11
3. The Past and the Future of Interposer Technology for Driving Solutions to High-Density Device Integration;Journal of The Japan Institute of Electronics Packaging;2019-08-01
4. Latest Trend of Packaging Technology to Meet the Demands of Next-Generation Electronic Devices;Journal of Japan Institute of Electronics Packaging;2017
5. Interposer Technology Development Which is the Most Appropriate for 2.5D Packaging;Journal of Japan Institute of Electronics Packaging;2015
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