Immersion Cooling of Electronics Utilizing Lotus-Type Porous Copper
Author:
Affiliation:
1. Tokyo University of Science-Yamaguchi
2. Advanced Knowledge Laboratory, Inc.
3. Institute for Lotus Materials Research Co. Ltd.
Publisher
Japan Institute of Electronics Packaging
Link
https://www.jstage.jst.go.jp/article/jiepeng/9/0/9_E16-013-1/_pdf
Reference22 articles.
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2. [2] K. Yuki, "Cooling Technology for the Next Generation SiC On-Vehicle Inverters," Journal of The Japan Institute of Electronics Packing, Vol. 18, No. 2, pp. 94-99, 2015.
3. [3] S. G. Kandlikar, Chapter 3 - Single-Phase Liquid Flow in Minichannels and Microchannels, Heat Transfer and Fluid Flow in Minichannels and Microchannels (Second Edition), Elsevier, pp. 103-174, 2014.
4. [4] T. Dixit and I. Ghosh, "Review of micro- and mini-channel heat sinks and heat exchangers for single phase fluids," Renewable and Sustainable Energy Reviews, Vol. 41, pp. 1298-1311, 2015.
5. [5] K. Yuki and K. Suzuki, "Applicability of Minichannel Cooling Fins to the Next Generation Power Devices as a Single-Phase-Flow Heat Transfer Device," Transactions of The Japan Institute of Electronics Packaging, Vol. 4, No. 1, pp. 52-60, 2011.
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1. Heat Transfer Enhancement in Two-phase Immersion Cooling with FC-72;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
2. Heat Transfer Enhancement Using Unidirectional Porous Media under High Heat Flux Conditions;Porous Fluids - Advances in Fluid Flow and Transport Phenomena in Porous Media;2021-08-18
3. Thermal management of automotive SiC-based on-board inverter with 500 W/cm2 in heat flux, and Two-phase immersion cooling by breathing phenomenon spontaneously induced by lotus porous copper jointed onto a grooved heat transfer surface;Journal of Thermal Science and Technology;2020
4. Two-Phase Immersion Cooling for Power Electronics with High Heat Flux Generation;Journal of The Japan Institute of Electronics Packaging;2018
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