Heat Transfer Enhancement in Two-phase Immersion Cooling with FC-72
Author:
Affiliation:
1. Sanyo-Onoda City University,Dept. of Mech. Eng,Yamaguchi,Japan
2. Lotus Thermal Solution Incorporated,Hyogo,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129648.pdf?arnumber=10129648
Reference3 articles.
1. Immersion Cooling of Electronics Utilizing Lotus-Type Porous Copper
2. Thermal management of automotive SiC-based on-board inverter with 500 W/cm2 in heat flux, and Two-phase immersion cooling by breathing phenomenon spontaneously induced by lotus porous copper jointed onto a grooved heat transfer surface;yuki;Phil Trans The Japan Society of Mechanical Engineers,2020
3. Enhancement of the critical heat flux of saturated pool boiling by the breathing phenomenon induced by lotus copper in combination with a grooved heat transfer surface
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1. Compact Two-Phase Immersion Cooling With Dielectric Fluid for PCB-Based Power Electronics;IEEE Open Journal of Power Electronics;2024
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