Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform-Reference-Cited by-同舟云学术

Silicon-Photonics-Embedded Interposers as Co-Packaged Optics Platform

Published:2022 Issue:0 Volume:15 Page:E21-012-1-E21-012-13
ISSN:1883-3365
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Takemura Koichi¹,Ohshima Daisuke¹,Noriki Akihiro¹,Okamoto Daisuke¹,Ukita Akio¹,Ushida Jun¹,Tokushima Masatoshi¹,Shimizu Takanori¹,Ogura Ichiro¹,Shimura Daisuke¹,Aoki Tsuyoshi¹,Amano Takeru¹,Nakamura Takahiro¹

Affiliation:

1. Photonics Electronics Technology Research Association

Publisher

Japan Institute of Electronics Packaging

Link

https://www.jstage.jst.go.jp/article/jiepeng/15/0/15_E21-012-1/_pdf

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