1. [1] S.-Z. Chu, J. Kumagai, T. Okita, T. Tamakawa, K. Okada, K. Nakaya, and N. Kato, "Contact Resistance Stability and Mechanism of Multilayered Sn/Ag Electroplating on Cu Alloys under High Temperture Circumstance," J. Surf. Finish. Soc. Jpn., Vol. 62, No. 11, pp. 559-567, 2011.
2. [2] Y. Nishimura, K. Baba, Y. Saka, M. Hattori, H. Honma, and T. Yamashita, "Friction and Wear Resistance of Electroplated Tin Films Co-deposited with PTFE Particles," Mater. Sci. Tech. Jpn., Vol. 50, No. 24, pp. 26-30, 2013.
3. [3] E. Takeuchi, Tribology for Mechanical Engineers, Taiga Publishing, 2008.
4. [4] H. Hashimoto, Learning Tribology from Basics, Morikita Publishing, 2006.
5. [5] Y. Tadokoro, N. Takezawa, S. Ito, M. Sato, T. Furusawa, and N. Suzuki, "Influence of Nickel Undercoat Resistance for Electronic Parts," Jounal of The Japan Institute of Electronics Packaging, Vol. 14, No. 4, pp. 296-304, 2011.