Synchrotron Micro-XRF Measurements of Trace Element Distributions in BGA Type Solders and Solder Joints-Reference-Cited by-同舟云学术

Synchrotron Micro-XRF Measurements of Trace Element Distributions in BGA Type Solders and Solder Joints

Published:2010 Issue:1 Volume:3 Page:40-46
ISSN:1884-8028
Container-title:Transactions of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Transactions of The Japan Institute of Electronics Packaging

Author:

Nogita Kazuhiro,Yasuda Hideyuki,Gourlay Christopher M.,Suenaga Shoichi,Tsukamoto Hideaki,Mcdonald Stuart D.,Takeuchi Akihisa,Uesugi Kentaro,Suzuki Yoshio

Publisher

Japan Institute of Electronics Packaging

Link

http://www.jstage.jst.go.jp/article/jiepeng/3/1/3_1_40/_pdf

Reference29 articles.

1. Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives

2. Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate

3. Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

4. Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

5. Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

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