Fluxless Reflow Process Using Solder Balls by Hydrogen Radical-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Fluxless Reflow Process Using Solder Balls by Hydrogen Radical

Published:2005 Issue:3 Volume:8 Page:225-232
ISSN:1343-9677
Container-title:Journal of Japan Institute of Electronics Packaging
language:
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

NAKAMORI Takashi,SUENAGA Makoto,HIRAKAWA Daisuke,OHNO Yasuhide,HAGIHARA Taizo,KAGAMI Johji,TAKEUCHI Tatsuya

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

http://www.jstage.jst.go.jp/article/jiep1998/8/3/8_3_225/_pdf

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Behavior of Hydrogen in Electrolessly Deposited Ni/Au and Ni/Pd/Au Films;Journal of The Surface Finishing Society of Japan;2019-03-01

2. Influence of Hydrogen in Electrolessly Deposited Ni-P/Au Films on Solder Wettability;Journal of The Surface Finishing Society of Japan;2018-09-01

3. Fluxless Lead-Free Soldering Process Employing Vacuum Technology;Journal of the Vacuum Society of Japan;2012

4. Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals;IEICE Transactions on Electronics;2009

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP