Fluxless Lead-Free Soldering Process Employing Vacuum Technology

Author:

HAGIHARA Taizo,TAKEUCHI Tatsuya,OHNO Yasuhide

Publisher

The Vacuum Society of Japan

Subject

Spectroscopy,Surfaces and Interfaces,Instrumentation,General Materials Science

Reference6 articles.

1. 2) I. Ghanashev, M. Nagatsu and H. Sugai: Jpn. J. Appl. Phys., 36 (1997) 337.

2. 3) H. Sugai: Journal of Plasma and Fusion Research, 77 (2001) 660.

3. 4) T. Nakamori, M. Suenaga, D. Hirakawa, Y. Ohno, T. Hagihara, J. Kagami and T. Takeuchi: Journal of Japan Institute of Electronics Packaging, 8 (2005) 225.

4. 5) D. Hirakawa, M. Suenaga, Y. Morizono, Y. Ohno, T. Hagihara, T. Takeuchi, S. Harini and N. Kuwano: Proc.16th Micro Electronics Symposium 2006, Osaka, Japan (Japan Institute of Electronics Packaging, Tokyo) p. 323.

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1. Study of Soldering Process with Formic Acid;Journal of Smart Processing;2023-09-10

2. Reduction of copper oxide by formic acid in a narrow gap under various conditions;Japanese Journal of Applied Physics;2023-07-01

3. Reduction process of copper oxide film by formic acid;Japanese Journal of Applied Physics;2021-10-12

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