Author:
Kashiwagi Yukiyasu,Nakamoto Masami
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Cited by
2 articles.
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1. 有機酸被覆銅微粒子を利用した低温焼成技術;Journal of Smart Processing;2022-11-10
2. Production of Copper Nanoparticles Dispersion Liquid Using New Copper Complex Solution;Journal of the Japan Society of Powder and Powder Metallurgy;2017