有機酸被覆銅微粒子を利用した低温焼成技術
Author:
Affiliation:
1. Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Subject
Industrial and Manufacturing Engineering,Surfaces, Coatings and Films
Link
https://www.jstage.jst.go.jp/article/jspmee/11/6/11_272/_pdf
Reference23 articles.
1. 1) K. Suganuma, M. Nogi, X. Jiu, H. Tokuno, and T. Araki: “Low Temperature Wiring for Printed Electronics”, J. Japan Inst. Electron. Packag., 14 (2011), 471-476. (in Japanese)
2. 2) K. Ozaki: “Development Trend of the Flexible Printed Circuits by Printing Technology”, J. Japan Inst. Electron. Packag., 14 (2011), 460-465. (in Japanese)
3. 3) M. Mäntysalo, P. Mansikkamäki: “An inkjet-deposited antenna for 2.4 GHz applications”, Int. J. Electron. Commun. (AEÜ), 63 (2009), 31-35.
4. 4) J. Kwon, H. Cho, H. Eom, H. Lee, Y. D. Suh, H. Moon, J. Shin, S. Hong and S. H. Ko: “Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications”, ACS Appl. Mater. Interfaces, 8 (2016), 11575-11582.
5. 5) J. Liu, H. Chen, H. Ji, and M. Li: “Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles”, ACS Appl. Mater. Interfaces, 8 (2016), 33289- 33298.
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