Solidification Process and Volume Fraction in Sn-Ag-Cu Alloy
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
http://www.jstage.jst.go.jp/article/jiep/13/7/13_7_521/_pdf
Reference17 articles.
1. 1) W. Kurz and D. J. Fisher: “Fundamentals of Solidification,” Trans. Tech. Publications, Switzerland, p. 99, 1984
2. Halo formation during unidirectional solidification of off-eutectic binary alloys
3. Characterization of Solidification Process in Sn-Cu Alloys Using an Interrupted Tests
4. Characterization of Solidification Process in Sn-Ag Alloys Using Interrupted Tests
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1. Effect of additional elements on the low-cycle-fatigue characteristics of Sn-1.0Ag-0.7Cu solder obtained using a miniature-sized specimen;International Journal of Fatigue;2018-11
2. Comparison of the Volume Fractions of Primary Sn Depending on the Holding Time in Sn-Ag and Sn-Pb Alloys;PRICM;2013-09-06
3. Effect of Isothermal Holding Time on the Volume Fractions of Primary ^|^beta;-Sn in Sn-Ag Alloys in Solid-Liquid Region;Journal of the Japan Institute of Metals and Materials;2013
4. Comparison of the Volume Fractions of Primary Sn Depending on the Holding Time in Sn-Ag and Sn-Pb Alloys;Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing;2013
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