Characterization of Solidification Process in Sn-Cu Alloys Using an Interrupted Tests-Reference-Cited by-同舟云学术

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Characterization of Solidification Process in Sn-Cu Alloys Using an Interrupted Tests

Published:2008 Issue:10 Volume:72 Page:804-811
ISSN:1880-6880
Container-title:Journal of the Japan Institute of Metals
language:ja
Short-container-title:J. Japan Inst. Metals

Author:

Miyauchi Yoshiko,Esaka Hisao,Tamura Manabu,Shinozuka Kei

Publisher

Japan Institute of Metals

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

https://www.jstage.jst.go.jp/article/jinstmet/72/10/72_10_804/_pdf

Reference10 articles.

1. 2) International Tin Research Institute internal report

2. The compression stress-strain behavior of Sn-Ag-Cu solder

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2. Effect of ZnO on the Nucleation of Primary β-Sn in Molten Sn or Sn-Ag Alloy;Journal of the Japan Institute of Metals and Materials;2018-06-01

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