1. 1) F. Carson, et al.: “The Development of the Fan-in Package-on-Package,” ECTC2008 S22-4
2. 2) J. Kim, et al: “Development of M2SP for PoP Bottom Package Solution,” ECTC2008 S25-2
3. 3) M. Ishihara, Y. Takehara, et al.: “A Dual Face Package Using Post with Wire Component; A Novel Structure for PoP, Wafer Level CSP and Compact Image Sensor Package,” ECTC2008 S25-3