Author:
Carson Flynn,Seong Min Lee ,In Sang Yoon
Cited by
5 articles.
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1. The Effect of Epoxy Molding Compound Dispensing Uniformity on PoP Warpage;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Technology Trends: Past, Present, and Future;Advanced Flip Chip Packaging;2013
3. Thermal characterization of Fan-in Package-on-Packages;2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM);2010-02
4. Development of a new Package-on-Package (PoP) structure for next-generation portable electronics;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010
5. 10.5104/jiep.13.358;Journal of Japan Institute of Electronics Packaging;2010