Reliability Analysis Issue on Recent Interconnect Materials
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/20/1/20_20/_pdf
Reference9 articles.
1. 6) Y. Kariya, S. Tajima, and S. Yamada: “Influence of crystallographic orientation on fatigue reliability of β-Sn and β-Sn micro-joint,” Materials Transactions, Vol. 53, No. 12, pp. 2067-2071, 2012
2. 7) A. Morozumi, H. Hokazono, Y. Nishimura, Y. Kariya, Y. Mochizuki, and Y. Takahashi: “Higher thermal cycling reliability of power semiconductor module for power converters,” Proc. of ICEP2016, pp. 405-410, 2016
3. 8) Y. Kariya, N. Williams, C. Gagg, and W. Plumbridge: “Tin pest in Sn-0.5wt.%Cu lead-free solder,” JOM, Vol. 53, No. 6, pp. 39-41, 2001
4. 9) Y. Yanaka, Y. Kariya, H. Watanabe, and H. Hokazono: “Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes,” Materials Transactions, Vol. 57, No. 6, pp. 819-823, 2016
5. 10) C. Lee and Y. C. Chen: “High temperature tin-copper joints produced at low process temperature for stress reduction,” Thin Solid Films, Vol. 286, No. 1, pp. 213-218, 1996
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