Tin pest in Sn-0.5 wt.% Cu lead-free solder-Reference-Cited by-同舟云学术

Tin pest in Sn-0.5 wt.% Cu lead-free solder

Published:2001-06 Issue:6 Volume:53 Page:39-41
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Kariya Yoshiharu,Williams Naomi,Gagg Colin,Plumbridge William

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s11837-001-0101-0.pdf

Reference8 articles.

1. D. Napp, SAMPE Journal, 32 (1996), p. 59.

2. B. Trumble, IEEE Spectrum, 35 (1998), p. 55.

3. For example, Lead Free Solder Project, Final Report, NCMS Report 0401RE96 (Ann Arbor, MI: National Center for Manufacturing Sciences, August 1997).

4. The Properties of Ti, Publ. 218 (Uxbtridge, U.K.: Tin Research Institute, 1954).

5. Y. Kariya, C.R. Gagg, and W.J. Plumbridge, Soldering and Surface Mount Technology, in print.

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