Study of New Removal Technique by Use of Magnetic Polishing Method for Copper Overhang Generated in the Direct Laser Via Process
Author:
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/17/4/17_292/_pdf
Reference4 articles.
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Study on Surface Finishing by Magnetic Mechanical Polishing of Various Shaped Ni-Ti Alloy Stent for Medical Use;Journal of The Surface Finishing Society of Japan;2021-11-01
2. Temperature monitoring with a high-speed camera based on two color method and its CFD analysis in Cu direct laser drilling of printed circuit board;Transactions of the JSME (in Japanese);2021
3. Estimation of monitoring image in laser blind via-hole drilling process of printed wiring boards with a high speed video camera and temperature visualization from obtained image by two-color method;Transactions of the JSME (in Japanese);2019
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