Author:
Hayashi Masahiro,Zhang Yi,Takagi Hideki,Hayase Masanori,Maeda Ryutaro,Ito Toshihiro
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Reference14 articles.
1. 1) V. K. Singh, M. Sasaki, and K. Hane: “Angled Exposure Method for Pattering on Three-Dimensional Structures,” Jpn. J. Appl. Phys., Vol. 46, No. 9B, pp. 6449-6453, 2007
2. 2) M. Murugesan, T. Fukushima, K. Kiyoyama, J. C. Bea, and T. Tanaka: “High-Step-Coverage Cu-lateral Interconnections over 100 μm Thick Chips on a Polymer Substrate - an Alternative Method to Wire Bonding,” J. Micromech. Microeng., Vol. 22, No. 8, 2010
3. 3) S. Takamatsu, T. Kobayashi, N. Shibayam, K. Miyake, and T. Itoh: “Meter-Scale Surface Capacitive Type of Touch Sensors Fabricated by Weaving Conductive-Polymer-Coated Fibers,” Proc. Of DTIP, pp. 142-147, 2011
4. 4) C. Siewert and F. Löffler: “Photolithographic Structuring of a Thin Metal Film Coil on a Zerodur Cylinder,” Surface & Coatings Technology, Vol. 200, pp. 1061-1064, 2005
5. 5) S. Uchiyama, Z. Q. Yang, A. Toda, M. Hayase, H. Takagi, T. Itoh, R. Maeda, and Y. Zhang: “Novel MEMS-Based Fabrivation Technology of Micro Solenoid-Type Inductor for Micro Energy Application,” Proc. PowerMEMS, pp. 26-29, 2012