Development and Mass Production of Double-Sided FPC Plated Directly on Polyimide Film Based on Molecular Bonding Technology-Reference-Cited by-同舟云学术

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Development and Mass Production of Double-Sided FPC Plated Directly on Polyimide Film Based on Molecular Bonding Technology

Published:2013 Issue:6 Volume:16 Page:450-456
ISSN:1343-9677
Container-title:Journal of The Japan Institute of Electronics Packaging
language:en
Short-container-title:Journal of Japan Institute of Electronics Packaging

Author:

Happoya Akihiko,Miyawaki Manabu,Michiwaki Shigeru,Takii Syuukichi,Kudo Takahiro,Mori Kunio

Publisher

Japan Institute of Electronics Packaging

Subject

Electrical and Electronic Engineering

Link

https://www.jstage.jst.go.jp/article/jiep/16/6/16_450/_pdf

Reference18 articles.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of Photosensitive Polyimides Compositions with Low Dielectric Property Corresponding to Semiconductor Back-End Processes;Journal of The Japan Institute of Electronics Packaging;2024-08-01

2. Recent Trends of High Wiring Densification of Printed Wiring Board and its Surface Treatment;Journal of the Surface Finishing Society of Japan;2014

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