Thermal Conductivity Measurement Method for Isotropic Conductive Adhesives-Reference-Cited by-同舟云学术

Thermal Conductivity Measurement Method for Isotropic Conductive Adhesives

Published:2015 Issue:1 Volume:28 Page:22-28
ISSN:0913-946X
Container-title:Netsu Bussei
language:en
Short-container-title:Jpn. J. Thermophys. Prop.

Author:

Ogushi Tetsuro¹,Yanaura Satoshi²,Watanabe Satoshi³,Hirata Takuya⁴

Affiliation:

1. Dept. of Information and Communication Technology, Fac. of Engineering, Hiroshima International University

2. Advanced Tech.R&D Cent., MITSUBISHI ELECTRIC CORP.

3. R&DCent., FUJIKURAKASEI Co.,LTD

4. Development Headquarters, ESPEC CORP.

Publisher

The Japan Society of Thermophysical Properties

Subject

General Medicine

Reference3 articles.

1. [1] ASTM D547-01; “Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials”(2001) ASTM International

2. [2] ASTM E1225-04; “Standard Test Method for Thermal Conductivity of Solids by Means of the Guarded Comparative Longitudinal Heat Flow Technique” (2004) ASTM International

3. [8] P.Teertstra; “Thermal conductivity and contact resistance measurements for adhesives”, Proc. of IPACK 2007 (2007)

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