A Study of Effective Thermal Conductivity of Bread Crust during the Process of Baking-Reference-Cited by-同舟云学术

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A Study of Effective Thermal Conductivity of Bread Crust during the Process of Baking

Published:2004 Issue:4 Volume:18 Page:130-135
ISSN:0913-946X
Container-title:Netsu Bussei
language:
Short-container-title:Jpn. J. Thermophys. Prop.

Author:

Yamada Seiji,Hiraiwa Takao,Takano Takayoshi

Publisher

The Japan Society of Thermophysical Properties

Subject

General Medicine

Reference8 articles.

1. [1] 藤山諭吉;「製パン理論と実際」,(日本パン技術研究所,1987), 103.

2. Effective Thermal Conductivity Measurement of Bread under Processing and Storage.

3. [3] S. Yamada, T. Hiraiwa, T. Takano, et al., Proc. 16th European Conf. Thermophysical Properties (2002), 327.

4. [4] 日本熱物性学会;「熱物性ハンドブック」,(養賢堂,1990), 451.

5. Determination of the thermal diffusivity of bread as a function of porosity

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Measurement of dough effective thermal conductivity using an integrated thermocouple during the bread baking process;Heat Transfer—Asian Research;2007

2. Measurement of Dough Effective Thermal Conductivity using Integrated Thermocouple under Bread Baking Process;Netsu Bussei;2006

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