Effective Thermal Conductivity Measurement and Analytical Heat Transfer Model on White Bread-Reference-Cited by-同舟云学术

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Effective Thermal Conductivity Measurement and Analytical Heat Transfer Model on White Bread

Published:2004 Issue:1 Volume:18 Page:7-13
ISSN:0913-946X
Container-title:Netsu Bussei
language:
Short-container-title:Jpn. J. Thermophys. Prop.

Author:

Tao Kei,Tadano Tetsuo,Suzuki lsao

Publisher

The Japan Society of Thermophysical Properties

Subject

General Medicine

Reference10 articles.

1. Thermal Conductivity of White Bread During Convective Heat Processing

2. [2] C. Johnsson, C. Skjoldebrand; Division of Food Eng., 33(1984), 333-341

3. [3] O. Krischer; VDI Forschungs, 11(1940), I-2

4. [4] O. Krischer; Forschung auf den Gebiete des lngenieurwesens, 22(1956),1-4

5. [5] A. H. Nissan, D. Hansen, J. L. Walker; Chem. Eng. Progress Symposium Series, 59(1963), 114-121

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Measurement of dough effective thermal conductivity using an integrated thermocouple during the bread baking process;Heat Transfer—Asian Research;2007

2. Measurement of Dough Effective Thermal Conductivity using Integrated Thermocouple under Bread Baking Process;Netsu Bussei;2006

3. A Study of Effective Thermal Conductivity of Bread Crust during the Process of Baking;Netsu Bussei;2004

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