Blended induction program for electronic engineering freshmen

Author:

Dayawansa Indra1,Wijenayake Chamith12,Edussooriya Chamira1,Samarasekara Thusitha1,Karunasekara Chamanthi1,Dias Dileeka1,Samarasinghe Kithsiri1,Kulasekere Chulantha1,Rodrigo Ranga1,Dayananda Nuwan1

Affiliation:

1. Department of Electronic and Telecommunication Engineering, University of Moratuwa, Moratuwa, Sri Lanka

2. School of Electrical Engineering and Telecommunications, University of New South Wales, Sydney, Australia

Abstract

This paper presents learning and teaching experiences gathered from an induction program conducted at the Department of Electronic and Telecommunication Engineering, University of Moratuwa, Sri Lanka for newly enrolled undergraduate students. The induction program, named as the pre-academic term, was an experimental effort to explore the applicability of blended leaning concepts to enhance the learning experience of Engineering freshmen, while enabling smooth transition from high school to university education. In addition to standard lectures, an integral part of the program was in-class demonstrations, where electronic circuits were assembled from scratch on a printed circuit board and demonstrated using a projected camera during the lectures. Organization, learning objectives, brief description of the example projects are presented along with a summary of formal student feedback. More than 85% of the freshmen indicated that the induction program helped them to smoothly begin the university education. A qualitative assessment in the laboratory work indicated that about 98% of the students successfully completed the assigned hands-on activities.

Publisher

SAGE Publications

Subject

Electrical and Electronic Engineering,Education

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Blended learning in the engineering field: A systematic literature review;Computer Applications in Engineering Education;2024-01-07

2. A Comprehensive Introductory Course Approach for Electrical and Computer Engineering Students;2023 32nd Annual Conference of the European Association for Education in Electrical and Information Engineering (EAEEIE);2023-06-14

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