Affiliation:
1. School of Materials Science & Nanotechnology, Jadavpur University, India
2. Department of Metallurgical & Material Engineering, Jadavpur University, India
Abstract
In this paper, we report leaching of precious and scattered metals such as gold (Au), copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), and lead (Pb) from printed circuit boards of scrap mobile phones by hydrometallurgical process using inorganic acid, organic acid and base. The amount of metals leached by different leachants are quantified using atomic absorption spectroscopy. Among various inorganic acids, aqua regia (mixture of nitric acid (HNO3) and hydrochloric acid) is found to be the strongest leachant for most of the metals such as Zn (2.04 wt %), Fe (17.90 wt %), Ni (0.66 wt %), Pb (5.86 wt %) and Au (0.04 wt %). The basic leachant, ammonium thiosulphate is found to be very effective in leaching of Au (0.03125 wt %). The dissolution of Cu in HNO3 gives the highest amount of Cu in the solvent, that is, ∼ 7.52 wt %. The metallic phases present in the electronic waste before and after leaching are identified by X-ray diffraction analysis. The microscopic structure has been studied using a scanning electron microscope which depicts erosion of the structure after leaching.
Funder
DEPARTMENT OF SCIENCE AND TECHNOLOGY (DST), GOVT OF INDIA, INSPIRE FELLOWSHIP
Subject
Pollution,Environmental Engineering
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献